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    Epoxy resin GLOD

    Current Location: HOMEPAGE >> Epoxy resin GLOD
    Epoxy resin GLOD
    Product details

    Glod? Series is ultra micro powder dicyandiamide, a latent curing agent, which is used as the curing system of one component epoxy resin formulation system. Narrow and stable particle size distribution, mainly used in high temperature curing system, with standard bisphenol A epoxy (EEW ≈ 190), the recommended proportion of 6-10phr, conventional curing conditions for 180 ℃ / 30min. Different particle sizes can meet different processes and application fields. With our GLOC? Organic urea accelerator, the curing temperature can be further reduced and the curing speed can be accelerated.



    Its main features are as follows:

    1. Application: prepreg, adhesive, powder coating.

    2. Packaging and storage: 6kg / carton, process bag, container bag or customized; sealed in the original container, stored in a cool and dry place, and the storage period shall not exceed 12 months.


    Service Telphome:0512-53611849

    Contact Us
    秋霞午夜理论理论福利无码
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